Back Grinding Tape (UV & NON-UV)
Back Grinding Tape (UV & NON-UV) Semiconductor Adhesive Tapes Adhesive Tape Penang, Malaysia, Simpang Ampat Supplier, Manufacturer, Supply, Supplies | Han Kook Tapes Sdn Bhd
  • Film thickness & adhesion variation depends on customer’s request & quantity.
  • Substrate to SUS Plate (#280 polished) & laminating pressure 1 cycle with 2 kgs rubber roller with remove speed 300mm/min. (Peeling angle: 180°C)

Please leave your enquiry here, we will reply as soon as possible.

*only support gif, jpeg, jpg, png, pdf
Switch To Desktop Version