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Back Grinding Tape (UV & NON-UV)
Back Grinding Tape (UV & NON-UV) Semiconductor Adhesive Tapes Adhesive Tape Penang, Malaysia, Simpang Ampat Supplier, Manufacturer, Supply, Supplies | Han Kook Tapes Sdn Bhd
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Features
  • Film thickness & adhesion variation depends on customer’s request & quantity.
  • Substrate to SUS Plate (#280 polished) & laminating pressure 1 cycle with 2 kgs rubber roller with remove speed 300mm/min. (Peeling angle: 180°C)

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